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| GaAs Solder Bump Flip Chip Schottky Diode Features * Low Series Resistance, 4 * Low Capacitance, 45 fF * High Cutoff Frequency * Silicon Nitride Passivation * Polyimide Scratch Protection * Solderable Bump Die Attach MADS-001317-1320AG V1 Mounting Side with Solder Bumps Description M/A-COM's MADS-001317-1320AG is a Gallium Arsenide Flip-Chip Schottky diode with solder bumps.These devices are fabricated on OMCVD epitaxial wafers using a process designed for high device uniformity and extremely low parasitics. This device can be used up to 80 GHz. This diode is fully passivated with silicon nitride and has an additional layer of a polymer for scratch protection. The protective coatings prevent damage to the junction during handling and circuit attachment. Applications The high cutoff frequency of this device allows use through millimeter wave frequencies. Typical applications include single and double balanced mixers in PCN tranceivers, radios, police radar detectors and automotive radar detectors Electrical Specifications TA = 25 C Parameters and Test Conditions Symbol Units MADS-0001317-1320AG Min Junction Capacitance at 0V at 1 MHz Total Capacitance at 0V at 1 MHz 1 Typ. .020 .045 4 7 Ct Rs Vf Vb pF Volts Volts .030 4.5 Max 0.030 .060 7 Dynamic Resistance at 9.5 mA - 10.5 mA Reverse Breakdown Voltage at 10uA Notes: 1. Total capacitance is equivalent to the sum of junction capacitance Cj and parasitic capacitance Cp. Specification Subject to Change Without Notice M/A-COM, Inc. ________________________________________________________________________________ 1 North America: Tel. (800) 366-2266 Fax (800) 618-8883 Asia/Pacific: Tel. Fax +85 2 2375 0618 +85 2 2375 0350 Europe: Tel. Fax +44 (1344) 869 595 +44 (1344) 300 020 GaAs Solder Bump Flip Chip Schottky Diode MADS-001317-1320AG V1.00 0.008" 0.013" (2) PL 0.011" (2) PL Circuit Mounting Dimensions ( Inches ) Specification Subject to Change Without Notice 2 ________________________________________________________________________________ M/A-COM, Inc. Asia/Pacific: Tel. Fax +85 2 2375 0618 +85 2 2375 0350 Europe: Tel. Fax +44 (1344) 869 595 +44 (1344) 300 020 North America: Tel. (800) 366-2266 Fax (800) 618-8883 GaAs Solder Bump Flip Chip Schottky Diode Device Installation Procedures The following guidelines should be observed to avoid damaging GaAs Flip-Chips. MADS-001317-1320AG V1.00 Cleanliness These devices should be handled in a clean environment. Do Not attempt to Clean Die After installation. Static Sensitivity Gallium arsenide Schottky diodes are ESD sensitive and can be damaged by static electricity. Since Schottky diodes are rated as Class 0, proper ESD techniques should be used when handling these devices. General Handling These devices have a polymer layer which provides scratch protection for the junction area and the anode air bridge. Die can be handled with plastic tweezers or picked and placed automatically with a #27 tip vacuum pencil. Assembly Requirements using Tin Lead Solder This Flip Chip Diode employs a 6um thick, Sn 63 / Pb 37 Solderable interface as part of the 50m high solder bump. These chips are designed to be soldered onto hard or soft substrates with the junction side down. They should be mounted onto silkscreened circuits using 60/40 Sn/Pb solder paste. A typical profile for a Sn 63/ Pb 37 Soldering process is provided in Application Note, M538 Surface Mounting Instructions on the M/A-COM website www.macom.com Typical SPICE PARAMETERS Is (A) 1.7E-14 Rs () 4.6 N 1.08 Ct0 ( pF ) .047 M .38 Ik (A) .016 Vj (V) .86 FC .99 BV (V) 7 IBV (A) 1.0E-5 Absolute Maximum Ratings @ 25C1 Parameter Operating Temperature Storage Temperature Incident LO Power Incident RF Power Mounting Temperature Maximum Ratings -65 C to +125 C -65 C to +150 C + 20 dBm + 20 dBm +300 C for 10 seconds Ordering Information Part Number MADS-001317-1320AG Packaging Gel Pack Notes 1.Exceeding these limits may cause permanent damage. Specification Subject to Change Without Notice M/A-COM, Inc. ________________________________________________________________________________ 3 North America: Tel. (800) 366-2266 Fax (800) 618-8883 Asia/Pacific: Tel. Fax +85 2 2375 0618 +85 2 2375 0350 Europe: Tel. Fax +44 (1344) 869 595 +44 (1344) 300 020 |
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